Sigla ICPAM With the support of:
European Physical Society Autoritatea Nationala pentru Cercetare Stiintifica

9th International Conference on Physics of Advanced Materials
20 - 23 September 2012, Iasi, Romania

Papers Publication

Conference papers will be published in a special issue dedicated to ICPAM-9 in:

Material Science and Engineering: B
Agreement for the publication of a special issue of the Material Science and Engineering B: Selected papers from ICPAM-9

The journal has now opened the EES site for submissions and recommended to the authors submitting papers to this special issue to select the article type 'ICPAM9 - INVITE ONLY'. Please also note the following important information we received from the journal:

Due to the request of many ICPAM-9 participants, the Editor of Materials Science and Engineering B extended the deadline for paper submission to 30th October 2012. The site will close at midnight on 30th October. On the 31st of October, any 'incomplete' paper will be automatically withdrawn.

1. Authors are given 20 days for their first revision, 10 days for the second revision and 7 days for the third revision. There will be no option for a 4th revision. The journal cannot grant any extensions on this timeframe and no exceptions will be made.

2. The journal has strict submission criteria relating to structure and format and all papers are subjected to technical screening for picking up on initial problems. If problems are detected, authors are given two attempts to correct those and if they are unable to do so, their paper will be withdrawn.

3. The Editor has agreed to set a word limit of 6,000 per paper. This count does not include references, tables etc.

Also, conference papers could be sent as regular papers to:

Journal of Optoelectronics and Advanced Materials

Journal of Advanced Research in Physics

Romanian Reports in Physics

Proceedings of the Romanian Academy

Journal of Nanoengineering and Nanomanufacturing


Detailed information about the submission procedure will be posted here soon.